VIS

According to 36Kr, TSMC-backed chip maker VIS inaugurated its first advanced wafer fab in Singapore via the VSMC joint venture with NXP, with production underway and a plan for a second factory. The plant began trial production in June, taking 18 months from groundbreaking to trial, and VIS says the first batch yield will be at least 99%. Mass production is planned for early 2027, and the facility will supply an intermediary packaging layer for Nvidia, Google, and Broadcom, with TSMC owning about 19% of VIS.