Longsys plans to invest 4.5 billion yuan in a wafer-level advanced packaging and testing project
According to 36Kr, Longsys and its subsidiary Guangdong Xincheng Hanqi will sign a cooperation agreement with the Dongguan Songshan Lake High‑Tech Zone Management Committee to invest in the third phase of a wafer‑level advanced packaging and testing manufacturing project, with a total investment of about 4.5 billion yuan, of which 4.0 billion yuan is fixed‑asset investment. The project will be built on existing industrial land and is financed with the company’s own and self‑raised funds, without new fundraising.
Key facts
- 01Longsys and its subsidiary Guangdong Xincheng Hanqi will sign a cooperation agreement with the Dongguan Songshan Lake High‑Tech Zone Management Committee.
- 02The investment is for the third phase of a wafer‑level advanced packaging and testing manufacturing project.
- 03Total investment is about 4.5 billion yuan, with 4.0 billion yuan allocated to fixed assets.
- 04The project will be built on existing industrial land and is financed with the company’s own and self‑raised funds, with no new fundraising.
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