Samsung announces plans to expand HBM4 and HBM4E production capacity

According to cnBeta, Samsung Electronics plans to expand production capacity for HBM4 and HBM4E, aiming to at least double the output of the HBM4 series by 2027 and shift its HBM mix toward higher-end products. The company projects monthly glass substrate washing to rise from about 20,000 pieces this year to 50,000 next year, with about 10,000 pieces in 2025, and expects HBM4 to grow from roughly 40% to about 80% of its total HBM shipments by 2027; 2026 HBM wafer input is seen at about 180,000 pieces, rising to about 250,000 by 2027.