Resonac Holdings develops a 300-mm silicon carbide substrate
According to Nikkei Asia, Resonac Holdings has become the first Japanese company to develop a 300‑mm silicon carbide substrate, a product that could quadruple the number of integrated circuits produced compared to current substrates. Larger silicon carbide substrates can produce more chips, but they have yet to be commercialized.
Key facts
- 01Resonac Holdings is a semiconductor materials maker.
- 02The 300‑mm SiC substrate could quadruple integrated circuit output compared to current substrates.
- 03Larger SiC substrates can produce more chips but are not yet commercialized.
- 04Resonac is the first Japanese company to develop this substrate.
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