FuriosaAI unveils details of its third-generation AI inference accelerator developed with Broadcom, including 2nm silicon, 12x48GB HBM4 memory stacks, PCIe Gen7 support, and 32 PFLOPS of performance
According to IT Home, FuriosaAI, together with Broadcom, unveiled details of its third-generation AI inference accelerator, featuring 2nm compute dies, a separate I/O die, 12 stacks of 48GB HBM4 memory, PCIe Gen7, and 32 PFLOPS of performance. The chip is said to have a physical size eight times that of the second generation, with 576GB of HBM memory and 48TB/s bandwidth, representing 12x and 32x increases respectively compared to RGND."
Key facts
- 01Collaboration between FuriosaAI and Broadcom to develop the accelerator.
- 02Third-generation AI inference accelerator details include 2nm compute dies and 12x48GB HBM4 stacks.
- 03Device supports PCIe Gen7 and delivers 32 PFLOPS of performance.
- 04Total HBM memory is 576GB and memory bandwidth is 48TB/s.
- 05Physical size is about 8x larger than the second generation (RGND).
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