Samsung Electro-Mechanics to invest 4.27 trillion won in Sejong substrate capacity
Samsung Electro-Mechanics will invest 4.27 trillion won ($3.14 billion) to expand FC-BGA substrate production at its Sejong plant, with production lines slated to run from September 2026 to May 2028 to meet AI server demand. This marks the largest single-product capital expenditure in the company’s history. The move targets growing needs for flip chip ball grid array substrates.